Altera Cyclone FPGA - Revision history

OZ1HFT: +cat

2010-01-25T18:33:57Z

+cat

AE5K: /* Soldering */

2009-05-03T12:43:59Z

‎Soldering

VK2NRA: add Gerd's advice

2009-05-03T04:53:02Z

add Gerd's advice

VK2NRA: Altera Cyclone II FPGA moved to Altera Cyclone FPGA: make general for Cyclone FPGAs

2009-05-03T04:39:43Z

Altera Cyclone II FPGA moved to Altera Cyclone FPGA: make general for Cyclone FPGAs

VK2NRA: fix links

2009-05-03T04:31:33Z

fix links

VK2NRA: start

2009-05-03T04:29:17Z

start

New page

The '''[http://en.wikipedia.org/wiki/Altera Altera] Cyclone II FPGA''' is used in the HPSDR [[Ozy]], [[Mercury]], and [[Penelope]] boards.

← Older revision		Revision as of 18:33, 25 January 2010
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	indicator shows a red colour you should bake the device at 120-130°C for 48		indicator shows a red colour you should bake the device at 120-130°C for 48
	hours before reflow soldering."</blockquote>		hours before reflow soldering."</blockquote>
		+
		+	[[Category:Hardware]]

@@ Line 3: / Line 3: @@
 == Soldering ==
-Gerd Loch [http://lists.openhpsdr.org/pipermail/hpsdr-openhpsdr.org/2009-May/009340.htm contributed] the following advice:
+Gerd Loch [http://lists.openhpsdr.org/pipermail/hpsdr-openhpsdr.org/2009-May/009340.html contributed] the following advice:
 <blockquote>"The device is mounted and bonded to a small pcb made of glass reinforced

← Older revision		Revision as of 04:53, 3 May 2009
Line 1:		Line 1:
−	The '''[http://en.wikipedia.org/wiki/Altera Altera] Cyclone II FPGA''' is used in the HPSDR [[OZY\|Ozy]], [[~~MERCURY~~\|~~Mercury~~]]~~, and~~ [[~~PENELOPE~~\|~~Penelope~~]] ~~boards~~.	+	The '''[http://en.wikipedia.org/wiki/Altera Altera] Cyclone II FPGA''' is used in the HPSDR [[OZY\|Ozy]], and [[PENELOPE\|Penelope]] boards. The Altera Cyclone III FPGA is used in the [[MERCURY\|Mercury]] board. Details on the devices are available at the [http://www.altera.com/products/devices/dev-index.jsp Altera site.].
		+
		+	== Soldering ==
		+
		+	Gerd Loch [http://lists.openhpsdr.org/pipermail/hpsdr-openhpsdr.org/2009-May/009340.htm contributed] the following advice:
		+
		+	<blockquote>"The device is mounted and bonded to a small pcb made of glass reinforced
		+	epoxy which is also used for "normal" pcb's. This material is hygroscopic
		+	and incorporates humidity from the ambient air.
		+	During reflow soldering the incorporated humidity explodes and leads to
		+	delamination of the carrier pcb and to discontinuities in traces and vias.
		+	This effect is called "popcorn effect"
		+	It is not so critical if you solder the device manually pin after pin and
		+	not heating the complete device in a short time up to 250°C.
		+	However you should keep the devices in the aluminized foil which contains
		+	some drying material until you are going to solder the device to your board.
		+	You will also find a humidity indicator in the foil which indicates if the
		+	content of the package has seen too much humidity. If the indicator is still
		+	blue you have not exceeded the acceptable level of humidity. If the
		+	indicator shows a red colour you should bake the device at 120-130°C for 48
		+	hours before reflow soldering."</blockquote>

← Older revision		Revision as of 04:31, 3 May 2009
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−	The '''[http://en.wikipedia.org/wiki/Altera Altera] Cyclone II FPGA''' is used in the HPSDR [[Ozy]], [[Mercury]], and [[Penelope]] boards.	+	The '''[http://en.wikipedia.org/wiki/Altera Altera] Cyclone II FPGA''' is used in the HPSDR [[OZY\|Ozy]], [[MERCURY\|Mercury]], and [[PENELOPE\|Penelope]] boards.

← Older revision	Revision as of 04:39, 3 May 2009
(No difference)