Difference between revisions of "Hermes Board Build Notes"

From HPSDRwiki
Jump to: navigation, search
Line 19: Line 19:
  
 
*KL7NA Specific Build Notes
 
*KL7NA Specific Build Notes
The basic method follows [http://www.youtube.com/watch?v=0FHvikd3BkY&feature=youtu.be this video].  I used the solder stencil to put on the solder paste.  Then the [http://people.wallawalla.edu/~Rob.Frohne/Hermes/back_paste.jpg surface mount components were placed.]  Then the board was baked in a [http://people.wallawalla.edu/~Rob.Frohne/Hermes/coming_out_oven.jpg reflow oven.]  This was repeated for the top.  Surface tension holds the bottom parts on when you reflow the top.  Then the solder bridges were removed with a very fine solder wick and a good soldering iron.  Then the through hole parts were soldered in.
+
The basic method follows [http://www.youtube.com/watch?v=0FHvikd3BkY&feature=youtu.be this video].  I used the solder stencil to put on the solder paste.  Then the [http://people.wallawalla.edu/~Rob.Frohne/Hermes/back_paste.jpg surface mount components were placed.]  Then the board was baked in a [http://people.wallawalla.edu/~Rob.Frohne/Hermes/coming_out_oven.jpg reflow oven.]  This was repeated for the top.  Surface tension holds the bottom parts on when you reflow the top.  Then the solder bridges were removed with a very fine solder wick and a good soldering iron.  Then the [http://people.wallawalla.edu/~Rob.Frohne/Hermes/top_bridges_repaired.jpg through hole parts were soldered in.]

Revision as of 13:38, 18 December 2012

This is a page to keep helpful documents and hints for building your own Hermes board. Bare circuit boards are available from link TAPR and after they run out, from Apache Labs. The bill of materials and schematics are available from Apache Labs.

  • KL7NA Specific Build Notes

The basic method follows this video. I used the solder stencil to put on the solder paste. Then the surface mount components were placed. Then the board was baked in a reflow oven. This was repeated for the top. Surface tension holds the bottom parts on when you reflow the top. Then the solder bridges were removed with a very fine solder wick and a good soldering iron. Then the through hole parts were soldered in.